Micromachining

In 1959, Richard P. Feynman (1965 Nobel Prize winner in Physics) proposed the idea of micromachining. In 1962, the first silicon micro pressure sensor came into being in computer gongs processing. After that, micromechanics such as gears, gear pumps, pneumatic turbines and connecting pieces with dimensions of 50-500 μ m were developed. In 1965, Stanford University developed a silicon brain electrode probe, and then succeeded in scanning tunneling microscope and micro sensor. In 1987, the University of California, Berkeley, developed a silicon micromotor with a rotor diameter of 60-12 μ m, which shows the potential of using silicon micromachining technology to make small movable structures compatible with integrated circuits to manufacture micro systems.

Large machinery and micro machinery have been attached great importance by government departments, enterprises, universities and research institutions abroad. At the end of 1980s, 15 scientists from MIT, Berkeley and Stanford / at & T in the United States put forward the national proposal of “small machine, big opportunity: report on emerging field micromechanics”, claiming that “due to the urgency of micromechanics (microsystem) in the United States, it should take the lead in the competition with other countries in this new and important technical field”, and suggested that the central government should advance expenses For five years, it has been valued by the leading organizations of the United States, continuously invested heavily, and regarded aerospace, information and MEMS as the three major priorities of science and technology development. NASA has invested 100 million US dollars to develop the “discovery microsatellite”. The National Science Foundation of the United States takes MEMS as a new rising research field and formulates a plan to support the research and development of micro electromechanical systems. Since 1998, it has funded eight universities such as MIT, University of California and Bell Laboratories to engage in research and development in this field, with annual funding of 100 Two million, two million to five million dollars in 1993. MEMS is listed as a key technology project in the report of “DOD technology plan” released in 1994. The advanced research projects agency of the U.S. Department of defense has actively led and supported the research and military application of MEMS. A standard MEMS process line has been built to promote the research and development of new components / devices. American industry is mainly engaged in the research of sensors, displacement sensors, strain gauges and accelerometers. Many organizations have participated in the research of micromechanical systems, such as Cornell University, Stanford University, University of California, Berkeley, University of Michigan, University of Wisconsin, old lunzdermore national research, etc. The Berkeley Center for sensors and actuators (BSAC) of the University of California has established a 1115m2 ultra clean laboratory for MEMS Research and development after receiving 15 million yuan from the Department of defense and more than a dozen companies.

In 1991, Japan’s Ministry of industry and industry started a 10-year, 25 billion yen micro large-scale research program, developing two prototypes, one for medical treatment, human body diagnosis and micro surgery, the other for industry, to repair the tiny cracks in aircraft engines and atomic energy equipment. Dozens of units, including Tsukuba University, Tokyo University of technology, Northeast University, Waseda University and Fujitsu Research Institute, participated in the project.

Grinding machine processing, European industrial developed countries have also invested heavily in the research and development of microsystems. Since 1988, Germany has started the 10-year plan for micromachining. From 1990 to 1993, its Ministry of science and technology allocated 40000 marks to support the research of “microsystem project”, and listed microsystems as the focus of scientific and technological development at the beginning of this century. The Liga process initiated by Germany provides a new technical means for the development of MEMS, And has become the preferred process of three-dimensional structure. France launched the 70 million franc “microsystem and technology” project in 1993. The European community formed the “multi-functional microsystem research network nexus”, which jointly coordinated the research of 46 research institutes. Switzerland has also invested in the development of MEMS on the basis of its traditional watch and clock manufacturing industry and small precision machinery industry, with an investment of US $10 million in 1992. The British government has also developed a nanoscience program. Eight projects are listed for research and development in the fields of mechanics, optics and electronics. In order to strengthen the development of MEMS in Europe, some European companies have formed MEMS development groups.

Grinding machine processing, At present, a large number of micromachines or micro systems have been developed. For example, a micro tweezer with a tip diameter of 5 μ M can clamp a red blood cell, a micro pump with a size of 7mm × 7mm × 2mm can run a car, a robot butterfly flying in a magnetic field, and a miniature inertial unit (MIMU) which integrates a micro speedometer, a micro gyroscope and a signal processing system. Germany created Liga process, which made cantilever beam, CNC machining center actuator, micro pump, micro nozzle, humidity, flow sensor and a variety of optical devices. Dongguan machine parts processing, California Institute of technology in the United States, a considerable number of 1 mm micro beams on the wing surface, to control its bending angle to affect the aerodynamic characteristics of the aircraft. High speed computer gongs process silicon accelerometers produced in large quantities in the United States. The micro sensors (mechanical parts) and integrated circuits (electrical signal sources, amplifiers, signal processing and calibration circuits, etc.) are integrated into the silicon chip within the range of 3mm × 3mm. The micro lathe developed in Japan with a square of several centimeters can process micro shafts with an accuracy of 1.5 μ M.